SWIR Cameras
SWIR Cameras
SWIR band cameras are used to inspect Silicon wafers and semiconductor die for void and edge defects. The technology is also used to detect moisture levels in packaged products, thickness and void detection on clear coat films, glass bottle imaging, bruise detection in fruits and vegetables, inspection of lumber products, detection of water/oil on metal parts, imaging through smoke and mist environments, surveillance and security monitoring, crop monitoring, glucose monitoring and many more applications including :
- Chemical inspection
- Hydrocarbon and gas detection
- Plastic sorting
- High speed thermal imaging
- Medical imaging
- Long range imaging through summer haze, maritime haze, and fine dust for automotive, surveillance and agricultural applications
- Wafer defect inspection
- Laser beam profiling
| Imaging Technology | Imager Mfr. | Wavelength Range | Interface | H x V pixels | Pixel Size | Imager Diagonal | Max. Frame Rate |
|---|---|---|---|---|---|---|---|
| InGaAs IMX991 USB3.0 Camera | Sony | 400 – 1700nm | USB3.0 | 640 x 512 | 5 µm | 4.1 mm | 258 f/sec |
| InGaAs IMX990 USB3.0 Camera | Sony | 400 – 1700nm | USB3.0 | 1280 x 1024 | 5 µm | 8.2 mm | 132 f/sec |
| InGaAs IMX990 nVidia Kit | Sony | 400 – 1700nm | Embedded, nVidia platform | 1296 x 1032 | 5 µm | 8.2 mm | 70~130 f/sec |
| Acuros® CQD® SWIR Cameras | SWIR Vision Systems | 400 – 1700nm | USB3.0 or GigE | 640 x 512 | 15 µm | 12.29 mm | 270 f/sec |
| 1280 x 1024 | 24.59 mm | 88 f/sec | |||||
| 1920 x 1080 | 33.04 mm | 58 f/sec | |||||
| Acuros® CQD® eSWIR Cameras | SWIR Vision Systems | 350 – 2000nm | USB3.0 or GigE | 640 x 512 | 15 µm | 12.29 mm | 270 f/sec |
| 1280 x 1024 | 24.59 mm | 88 f/sec | |||||
| 1920 x 1080 | 33.04 mm | 58 f/sec |
Bruising and incipient spoilage in fruit is detectable via SWIR imaging, but not via VIS imaging.
Silicon wafers are transparent when viewed with a SWIR camera but opaque under normal VIS imaging.
